ケンタのブレーン

製造流程
將PCB設計圖像(Pattern)的工程資料由CAD/CAM上轉移至網板或底片上
使用印刷或曝光方式將底片上影像移轉至負光阻劑(光照凝固)上
再經由蝕刻、電鍍或單純顯像方式製作線路或遮蓋部分板面 

基板處理

PCB設計流程筆記

系統規格確定
首先要先規劃出該電子設備的各項系統規格。包含了系統功能，成本限制，大小，運作情形等等。

系統功能區塊圖
接下來必須要製作出系統的功能區塊圖。區塊間的關係也必須要標示出來。

影響BGA bending reliability life的因素
收錄在Robert Darveaux 的"Reliability of Area Array Solder Joints In Bending"文中

The reliability of area array solder joints in bending was investigated by both testing and analytical methods. Variables in the cyclic testing included bending configuration, control method, support span distance, defection distance, test board thickness, package thickness, body size, substrate technology, and die size. For each test, the cycles to failure and failure mode were monitored. As the stress level increased, the failure mode changed from solder failure to test board trace failure. For displacement controlled tests, fatigue life decreased with a) a decrease in support span length, b) an increase in test board thickness, c) an increase in die size, and d) an increase in mold cap thickness. Simulation results indicate that the optimum component / motherboard pad size ratio is not the same for bending fatigue as it is for thermal cycle fatigue.

Effect of Support Span

陣列錫球錫裂的四種失效行為模式, 收錄在Robert Darveaux 的"Reliability of Area Array Solder Joints In Bending"文中

Four different failure modes were observed in the bend testing. These are shown schematically in Figure 11.

磁阻效應(Magnetoresistance Effect)或是霍爾效應(Hall Effect)應用的感測器。

霍爾感測器以霍爾效應為其工作基礎，霍爾效應是半導體自由電荷受磁場勞倫斯力(Lorentz force)作用(Y軸向)而產生，霍爾電場產生的力直至與勞倫斯力相等。

此時半導體片所輸出的穩定電壓為霍爾電壓Vh(X軸向)，它是由美國物理學家霍爾(Edwin H. Hall)在1879年發現的。

LAB 色空間有三個色軸
一為影響灰色系的明度軸 L，
另外二個為不影響灰色系的色軸，一為(紅---綠) A 色軸，另一為(黃---藍) B 色軸。
DL：正值（偏白)；負值(偏黑)     
DA：正值（偏紅)；負值(偏綠)